Canon launches new semiconductor lithography machine FPA-5550iX for full-frame CMOS manufacturing, etc.
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Update time : 2023-03-16 11:41:32
Canon today announced the FPA-5550iX, a new semiconductor lithography machine for the front-end process that achieves both high resolution at 0.5μm (micron) and large field of view exposure at 50×50mm. The new FPA-5550iX is capable of achieving both high resolution of 0.5μm (micron) and large field of view of 50×50mm.
The new FPA-5550iX is capable of simultaneously achieving a large 50×50mm field of view and 0.5μm high resolution exposure, making it possible to image with high resolution in a single exposure in the field of full-frame CMOS sensor manufacturing, which is becoming increasingly sophisticated. The FPA-5550iX can also be used in the exposure process for the manufacture of small display devices such as head-mounted displays by taking advantage of the high resolution and large field of view. In addition, as demand for advanced XR device displays increases, this product can also be widely used in the manufacture of micro OLED displays with large fields of view and high contrast.
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