We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Home
Products
Hot Stock
TI Hot parts
CHIP/IC
CHIP / IC
Active devices
Diode / Transistor Crystal oscillator
Passive device
Capacitor Resistor Inductor
Components
Switch Connector Potentiometer LED/Nixie tube Bridge Rectifiers Connecting cables Relay Module Fuse tube PCB boards Speakers/Pickup Transmitter/receiver Component combination Other components
MORE
MORE (1) MORE (2) MORE (3) MORE (4) MORE (5)
OTHER
OTHER IC
.
XT Series
UA Series
LT Series
HM Series
PI Series
KM Series
WD Series
RP Series
FK Series
FS Series
DC Series
TD Series
FP Series
AI Series
VB Series
CH Series
TJ Series
EP Series
DD Series
KK Series
NR Series
JF Series
UN Series
TY Series
CJ Series
LN Series
BD Series
KD Series
UY Series
LK Series
ET Series
UB Series
CT Series
VT Series
TE Series
HV Series
DK Series
UP Series
FO Series
KX Series
US Series
VM Series
XS Series
GM Series
SS Series
HP Series
PR Series
DE Series
VL Series
VW Series
MT Series
AL Series
GL Series
XC Series
UL Series
EF Series
HC Series
DH Series
AO Series
TG Series
PM Series
RF Series
GN Series
LY Series
BZ Series
BT Series
IM Series
UG Series
IT Series
PW Series
SH Series
HR Series
HI Series
HZ Series
BN Series
IC Series
IS Series
AE Series
PN Series
VP Series
GD Series
AB Series
CW Series
Hot Stock
RFQ
Contact Us
Who We Are
What We Do
Industry News
Home > Industry News

New i-ToF Image Sensor Enables Smaller 3D Camera Systems and Improves Quantum Efficiency While Optimizing Cost

Views : 74
Update time : 2023-03-31 11:55:58
        Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and its premium 3D ToF-focused partner, pmd, have jointly launched the IRS2976C time-of-flight (ToF) VGA sensor, a performance-advanced version of the IRS2877C ToF VGA sensor. VGA sensor. The sensor is a new member of the REAL3™ family of products.
 
 
        It features Infineon's new pixel technology, which increases the pixel quantum efficiency to more than 30%, a level hitherto achieved only by backside illumination (BSI) sensors, while maintaining the cost advantage of front-side illumination (FSI) sensors. As a result, the IRS2976C image sensor is the world's first ToF image sensor to receive Google's Level 3 (Enhanced) certification for face recognition and to operate seamlessly under the display of mobile devices. 
        The IRS2976C image sensor supports a wide range of long-range, low-power usage scenarios, with measurement distances up to and beyond 10 meters. Like all other members of the REAL3™ family, each pixel of this image sensor features Surplus's patented background illumination suppression (SBI) technology to provide robust data in high dynamic range (HDR) and daylight scenes. 
        Our unique ToF CMOS process ensures superior sensitivity and robustness in both indoor and outdoor environments," said Christian Herzum, vice president of Infineon Technologies' 3D sensing business. In addition, our IRS2976C 3D ToF image sensor offers powerful features and excellent flexibility to optimize 3D camera system designs. The sensor is ideal for secure authentication in applications such as smartphones, payment terminals, and smart locks, as well as for virtual reality and augmented reality (AR/VR) headsets, service robots, and various IoT devices. 
        The IRS2976C image sensor supports a system VGA resolution of 640 x 480. With a world-leading compact form factor of 23 mm², the image sensor is easily compatible with the previous IRS2877C image sensor and can be upgraded very easily. The ultra-high level of integration allows the sensor to use significantly less material, with a smaller form factor and simpler design. The new IRS2976C image sensor can be used with Infineon's latest VCSEL driver, the IRS9102C, to help developers design smaller, lower cost 3D camera systems.



 
Previous :
Next :
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i
Email