We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Industry News

TSMC 1nm chip factory has landed: investment of 200 billion is much higher than 3nm

Views : 134
Update time : 2022-12-06 10:17:57
        After the global core shortage, major fabs are actively expanding chip production capacity. Especially after entering 2022, major fabs continue to expand production. Among them, TSMC plans to spend up to $44 billion this year, mainly to build 6 factories and promote research and development of new technologies.
        Earlier, TSMC officially announced the 3nm chip, saying that the 3nm chip will be officially mass-produced in the second half of 2022, while the 2nm chip will be officially mass-produced in 2025. That is to say, although Samsung released the 3nm chip earlier than TSMC, Samsung still does not have the exact time for mass production of the 3nm chip. According to the news, Samsung's 3nm chip's yield rate is only 10%, resulting in it having to increase its own production and sales. TSMC's 3nm chip production capacity has been booked, mainly for manufacturers such as Apple and Intel. Among them, Intel has also adopted a prepaid form to obtain the first production capacity of TSMC's 3nm chips. There is also news that Qualcomm's 3nm chip orders are already queuing up. This shows how popular advanced process technology is. Moreover, chip processing below 7nm has contributed more than 50% of TSMC's revenue.
        Among TSMC's next-generation advanced processes, 3nm will be produced in volume next year, and the 2nm process will be mass-produced in 2025. There is no clear plan for the 1nm process in the future, but the plant is almost complete. The head of Hsinchu Science Park said today that TSMC's future 1nm plant will be located in Zhuke Longtan Park.
Currently, TSMC is only in the early stages of determining site selection, and there are still many processes to follow. Even if all goes well, the construction cycle of the advanced chip factory is at least 3 years. In addition, the 2nm process will be mass-produced in 2025, and the 1nm process will be mass-produced at least until 2028. As for the specific technical details, it is even more impossible to talk about, but TSMC will use GAA transistor technology after 2nm, and 1nm will be no exception.
There is also the amount of investment. The construction capital of TSMC's 3nm and 5nm plants is about $20 billion, and the investment plan for the 1nm process is as high as $32 billion, easily exceeding 200 billion yuan, and the cost is much higher than the previous process.
        One of the important reasons is the next generation of EUV lithography machines. The current AMSL EUV lithography machine can meet the needs of the 3nm process. The process after 2nm will be performed on the high NA technology EUV lithography machine. Model NXE: 5200. The price has skyrocketed from the current $150 million to over $400 million.
 
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i