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Home > Industry News

Intel to unveil new process roadmap post Intel 18A in February

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Update time : 2024-01-15 10:20:52
        In addition to launching its IDM 2.0 strategy in 2021, which involves the use of both internal and external manufacturing capabilities, Intel has outlined a "five nodes in four years" program, dubbed "5N4Y". The pinnacle of the program is Intel 18A (1.8nm-class) technology, which is scheduled to enter production in early 2025. But little is known about Intel's plans after 18A, and Intel's latest indication is that it will announce a roadmap for the new process in February.
 
 
        Intel plans to host an IFS Direct Connect event on February 21, where Intel Foundry Services (IFS) will discuss the roadmap beyond 5N4Y. Guest speakers at the event include Intel CEO Pat Kissinger (Pat Gelsinger), IFS General Manager Stu Pann, Intel General Manager of Supply Chain and Operations Keyvan Esfarjani, and Intel Executive Vice President for Process Technology Development Ann Kelleher. 
        Intel described the IFS Direct event as follows:
        "Hear Intel leaders, technologists and partners share detailed information about our strategy, process technologies, advanced packaging and ecosystem. Learn how Intel Foundry Services can help you build chip designs utilizing Intel's resilient, secure and sustainable sources of supply." 
        It's unclear what improvements are available in the new process beyond Intel 18A, but it's expected that Intel will continue to evolve its innovations.Intel 20A introduced RibbonFET ring-gate (GAA) transistors and PowerVia backside power supply network (BSPDN), while Intel 18A perfected both of these technologies. At the recent IEDM event, Intel outlined the further evolution of BSPDN, so it is expected that one of the new processes after Intel 18A will use this technology.GAA will obviously continue to evolve as well, and it is expected that Intel will innovate in this area as well. 
        At the same time, differences in chip requirements for different applications have forced Intel to specialize in various process technologies. For example, Intel 3 offers denser high-performance libraries and higher drive currents, which are the dedicated requirements of data center-class processors. Whether this approach will be expanded and whether Intel will offer other specialized nodes remains in doubt.
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