We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Home
Products
Hot Stock
TI Hot parts
CHIP/IC
CHIP / IC
Active devices
Diode / Transistor Crystal oscillator
Passive device
Capacitor Resistor Inductor
Components
Switch Connector Potentiometer LED/Nixie tube Bridge Rectifiers Connecting cables Relay Module Fuse tube PCB boards Speakers/Pickup Transmitter/receiver Component combination Other components
MORE
MORE (1) MORE (2) MORE (3) MORE (4) MORE (5)
OTHER
OTHER IC
.
XT Series
UA Series
LT Series
HM Series
PI Series
KM Series
WD Series
RP Series
FK Series
FS Series
DC Series
TD Series
FP Series
AI Series
VB Series
CH Series
TJ Series
EP Series
DD Series
KK Series
NR Series
JF Series
UN Series
TY Series
CJ Series
LN Series
BD Series
KD Series
UY Series
LK Series
ET Series
UB Series
CT Series
VT Series
TE Series
HV Series
DK Series
UP Series
FO Series
KX Series
US Series
VM Series
XS Series
GM Series
SS Series
HP Series
PR Series
DE Series
VL Series
VW Series
MT Series
AL Series
GL Series
XC Series
UL Series
EF Series
HC Series
DH Series
AO Series
TG Series
PM Series
RF Series
GN Series
LY Series
BZ Series
BT Series
IM Series
UG Series
IT Series
PW Series
SH Series
HR Series
HI Series
HZ Series
BN Series
IC Series
IS Series
AE Series
PN Series
VP Series
GD Series
AB Series
CW Series
Hot Stock
RFQ
Contact Us
Who We Are
What We Do
Industry News
Home > Industry News

Kyocera Announces $9.78 Billion Investment Plan for Next Three Years

Views : 79
Update time : 2023-01-05 09:49:12
        Dec. 28 (Bloomberg) -- Japanese semiconductor components and materials major Kyocera intends to spend $9.78 billion over the next three years to further expand its related businesses, including semiconductors, mainly for capital expenditures such as plant construction, as well as research and development expenses, Nikkei Asia reported. The investment is about twice the amount Kyocera has invested in the same project over the past three years.
 
 
 
        As part of the $9.78 billion investment plan, Kyocera will build a new semiconductor packaging plant in Kagoshima Prefecture, Japan. The construction of the plant is expected to cost about 60 billion yen ($450 million).
        It is worth noting that in August this year, Kyocera had announced plans to invest 15 billion yen in the construction of a new plant in the Kagoshima Kokubu factory site, targeting a 20 percent increase in its MLCC production capacity.
        Kyocera will also establish a new manufacturing plant in Nagasaki, will focus on the manufacture of "ceramic components and semiconductor packages. Many semiconductor packages are made of ceramic materials. The facility will reportedly cost up to 100 billion yen (about $746 million) to build and is expected to be operational by 2026.
        In addition, Kyocera plans to expand some of its existing plants that produce multifunction printers and quartz components. It is a major producer of crystal oscillators, a circuit usually made of quartz that helps regulate the clock speed of processors.
        Kyocera reportedly plans to finance its planned investment by borrowing up to 1 trillion yen. The company is expected to use its 15 percent stake in Japan's second-largest telecommunications company KDDI Corp. as collateral for the debt financing. It will reportedly start borrowing by March 2023 and aims to raise up to 500 billion yen over the next three years.


 
Previous :
Next :
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i
Email