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Home > Industry News

Samsung will spend 40 billion yen to build a factory in Japan, targeting cutting-edge chip packaging technology

Views : 29
Update time : 2024-01-05 10:05:15
        December 21 news, recently, Samsung announced that it will invest up to 40 billion yen in Japan in the next five years for the construction of an advanced chip research and development facilities, located in Yokohama, Kanagawa Prefecture, Japan.
        The institute was announced by Kyung Kye-hyun, Samsung's chief executive officer in charge of the chip business, based in Japan, he said the move will consolidate the company's leading position in the chip industry, and will be located in Yokohama with the help of the packaging field of business alliances to promote cooperation and exchange. Earlier reports mentioned that Samsung is considering building another packaging plant in Japan's Kanagawa Prefecture to deepen its close relationship with local suppliers of chip manufacturing equipment and raw materials. Samsung already has a research and development center here.
        It is reported that the R & D facilities will focus on cutting-edge chip packaging technology research. As early as March this year, Samsung said it intends to establish a chip packaging plant in Kanagawa to strengthen cooperation with Japanese chip equipment and materials manufacturers. Samsung already has a research and development center in the region, the investment will further deepen its ties with the Japanese technology sector. It is worth mentioning that the Japanese government also plans to provide up to 20 billion yen in subsidies to revitalize the country's chip R & D and manufacturing ecosystem.
        This initiative coincides with the increasingly intense chip game between China, the United States and Japan, Samsung since last year has begun to vigorously enhance the chip packaging technology, with a view to gaining a competitive advantage in this key link. Chip packaging refers to the packaging of multiple components on a single chip, thereby realizing a smaller size and higher energy efficiency.
        The industry is probably actively promoting the development of a new generation of packaging technology, that is, the integration of multiple components into the same package, in order to enhance the overall performance of the chip. Research organization Yole pointed out that despite the poor performance of the market in the first half of the year, but with the market rebound in the third quarter, the advanced packaging market is expected to grow up to 23.8%, predicted that this year will continue to hold steady growth, and the next five years will reach an average annual growth rate of 8.7%, foreseeing that the market in 2028 will be 43.9 billion U.S. dollars in 2022 to 72.4 billion U.S. dollars. Looking ahead to 2023, Yole expects the semiconductor industry to meet tough challenges, and the new era packaging market will remain stable at $43 billion. It is expected that the advanced packaging market in 2.5D/3D, FCBGA and FO will increase slightly, while other technology platforms may face a decline in revenue due to weak demand in the mobile and consumer markets.
        Currently, Samsung is the world's second largest semiconductor chip maker, but its foundry market share is much lower than its rival TSMC. The company plans to invest $230 billion over the next few years to overtake TSMC as the world's largest chipmaker.
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