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Semiconductor giant Broadcom has said it will consider Intel chip foundry: "3nm." Is it possible to replace TSMC?

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Update time : 2023-02-07 12:00:25
        In the global foundry market,TSMC is the company with the largest production capacity and the most advanced technology, but the uncertainty facing the future will increase. Therefore, many semiconductor companies are also actively seeking new foundry partners and have also mixed in. The semiconductor giant said it would consider using Intel foundry to replace TSMC.
        Broadcom CEO Chen Fuyang talked about the company's strategy in an interview a few days ago, saying he is still looking for new semiconductor mergers and acquisitions. Although the $142 billion acquisition in 2018 was banned by the United States, and the $69 billion VMare acquisition is still under anti-monopoly review in Europe and the United States, mergers and acquisitions remain a key part of Broadcom's strategy. They have a select list, including semiconductor chip and software companies.

        However, Broadcom CEO Chen Fuyang did not specify which company he would buy next. In addition, he also discussed the company's foundry options. At present, only a few parts of Broadcom are produced in-house, and most chips still need to be outsourced. The current main partner is TSMC, but Chen Fuyang also said that he is considering Intel as a potential foundry partner, which will become an alternative supplier to TSMC.
        As one of the world's leading fabless semiconductor designers, Broadcom's announcement is a great benefit to Intel. Previously, Intel has previously said it is in talks with 7 of the world's top 10 semiconductor manufacturers, and Broadcom is clearly one of them. As for the specific process used by Broadcom, it is still uncertain, but the two sides are still some time away from signing the real foundry contract, so it is more likely to use the Intel 3 process that will be mass-produced at the end of this year, which is the main process of Intel's external foundry. The standard 3nm friend process.

 
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