We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Home
Products
Hot Stock
TI Hot parts
CHIP/IC
CHIP / IC
Active devices
Diode / Transistor Crystal oscillator
Passive device
Capacitor Resistor Inductor
Components
Switch Connector Potentiometer LED/Nixie tube Bridge Rectifiers Connecting cables Relay Module Fuse tube PCB boards Speakers/Pickup Transmitter/receiver Component combination Other components
MORE
MORE (1) MORE (2) MORE (3) MORE (4) MORE (5)
OTHER
OTHER IC
.
XT Series
UA Series
LT Series
HM Series
PI Series
KM Series
WD Series
RP Series
FK Series
FS Series
DC Series
TD Series
FP Series
AI Series
VB Series
CH Series
TJ Series
EP Series
DD Series
KK Series
NR Series
JF Series
UN Series
TY Series
CJ Series
LN Series
BD Series
KD Series
UY Series
LK Series
ET Series
UB Series
CT Series
VT Series
TE Series
HV Series
DK Series
UP Series
FO Series
KX Series
US Series
VM Series
XS Series
GM Series
SS Series
HP Series
PR Series
DE Series
VL Series
VW Series
MT Series
AL Series
GL Series
XC Series
UL Series
EF Series
HC Series
DH Series
AO Series
TG Series
PM Series
RF Series
GN Series
LY Series
BZ Series
BT Series
IM Series
UG Series
IT Series
PW Series
SH Series
HR Series
HI Series
HZ Series
BN Series
IC Series
IS Series
AE Series
PN Series
VP Series
GD Series
AB Series
CW Series
Hot Stock
RFQ
Contact Us
Who We Are
What We Do
Industry News
Home > Industry News

Apple iPhone A17 chips in the 15/Pro series focus more on battery life than performance

Views : 111
Update time : 2023-01-06 11:45:51
        According to 9to5 Mac, the Apple A17 chip expected to be used in the iPhone 15 may focus more on battery life improvements than processing performance. Apple chipmaker TSMC emphasized energy efficiency rather than performance when discussing the 3nm process designed for the iPhone 15 series.
 
 
        TSMC has been leading the chip manufacturing industry in the use of increasingly advanced processes. Next year's Apple iPhone 15 series, as well as Mac products powered by the new M2 Pro chips, are expected to use TSMC's new 3nm process — mass production has already begun. Moving to the 3nm process will be an important step. The A16 chip in Apple's iPhone 14 Pro model uses a "4nm process," but TSMC describes the N4 process used for the processor as an enhanced version of 5nm — so it will actually jump straight from 5nm to 3nm.
        Each new generation of processes allows more performance on a chip of the same size. Typically, there is a balance between performance and power consumption, and Apple's chips are designed to provide a good combination of performance and efficiency cores.
        TSMC is preparing for 3nm production of the A17 chip. Currently, there are still nine months before the release of the new Apple iPhone 15, and TSMC's factories will have enough time to prepare. TSMC celebrated the start of mass production of 3nm chips. IT House has learned that this new process is expected to have the new M2 Pro chip in Apple's Mac first, ahead of the A17 processor in iPhone 15. Future Apple M3 chips are also expected to use the 3nm process.
        TSMC Chairman Mark Liu said his 3nm process has better performance than 5nm chips, while reducing power consumption by about 35%. Apple will of course participate in the design of chips produced by TSMC, and is free to use higher transistor density to meet the goal. While the chipmaker seems to prefer to emphasize energy efficiency over performance, it is not clear that this will also be a priority for Apple's A17 chip. Similarly, since iPhone chips rarely get limited in performance, many users also welcome greater battery life improvements. In terms of the M2 Pro chip for Mac devices in 2023, Apple will try to squeeze as much performance out of the chip as possible, although Apple Silicon chips will also achieve incredible energy efficiency.

 
Previous :
Next :
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i
Email