We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Home
Products
Hot Stock
TI Hot parts
CHIP/IC
CHIP / IC
Active devices
Diode / Transistor Crystal oscillator
Passive device
Capacitor Resistor Inductor
Components
Switch Connector Potentiometer LED/Nixie tube Bridge Rectifiers Connecting cables Relay Module Fuse tube PCB boards Speakers/Pickup Transmitter/receiver Component combination Other components
MORE
MORE (1) MORE (2) MORE (3) MORE (4) MORE (5)
OTHER
OTHER IC
.
XT Series
UA Series
LT Series
HM Series
PI Series
KM Series
WD Series
RP Series
FK Series
FS Series
DC Series
TD Series
FP Series
AI Series
VB Series
CH Series
TJ Series
EP Series
DD Series
KK Series
NR Series
JF Series
UN Series
TY Series
CJ Series
LN Series
BD Series
KD Series
UY Series
LK Series
ET Series
UB Series
CT Series
VT Series
TE Series
HV Series
DK Series
UP Series
FO Series
KX Series
US Series
VM Series
XS Series
GM Series
SS Series
HP Series
PR Series
DE Series
VL Series
VW Series
MT Series
AL Series
GL Series
XC Series
UL Series
EF Series
HC Series
DH Series
AO Series
TG Series
PM Series
RF Series
GN Series
LY Series
BZ Series
BT Series
IM Series
UG Series
IT Series
PW Series
SH Series
HR Series
HI Series
HZ Series
BN Series
IC Series
IS Series
AE Series
PN Series
VP Series
GD Series
AB Series
CW Series
Hot Stock
RFQ
Contact Us
Who We Are
What We Do
Industry News
Home > Industry News

Arm Cortex-X5 mega-core revelation: expected to catch up with Apple, Galaxy S25 on board

Views : 55
Update time : 2024-01-22 09:44:07
        The next generation Arm Cortex CPU core is expected to be the most powerful CPU core on a smartphone to date, according to a report by research firm Moor Insights and Strategy. The latest mega-core architecture is the Cortex-X4, so the next CPU core architecture is expected to be the Cortex-X5, codenamed "Blackhawk".
 
 
        According to the report, the "Blackhawk" core will appear in smartphones launched at the end of this year or later, and is expected to be carried by the Samsung Galaxy S25 series. Samsung's self-produced Exynos 2500 SoC chip is expected to use the 3nm process, using the Cortex-X5 mega-core. 
        In the mobile SoC market, Apple's self-developed A-series chip CPU single-core performance has always maintained a leading position, iPhone 15 Pro series equipped with the A17 Pro chip, Geekbench 6 single-core score up to 2,980, which is about 27% higher than the Qualcomm Snapdragon 8 Gen3 (which carries a 3.30GHz Cortex-X4 mega-core). The tipster said that the next-generation Cortex-X5 will outperform Apple for the first time in terms of single-core performance, and that Arm's plan is to close the performance gap between its official processor architectures and custom Arm platforms. The "Blackhawk" cores achieved the largest year-over-year increase in IPC performance in five years, while delivering excellent LLM (Large Language Model) performance.
        Sources say that the Galaxy S25 could be powered by two SoC chips, the Exynos 2500 will be powered by a Cortex-X5 CPU core, while the Snapdragon 8 Gen4 is expected to be powered by Qualcomm's in-house developed Oryon CPU core, also comparable to Apple. Additionally, the MediaTek Tenguix 9400 is also expected to feature 3 Cortex-X5 mega cores. So around 2025 you can expect the CPU single-core score of Android phones to beat Apple's iPhone 16 Pro.
Previous :
Next :
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i
Email