We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Home
Products
Hot Stock
TI Hot parts
CHIP/IC
CHIP / IC
Active devices
Diode / Transistor Crystal oscillator
Passive device
Capacitor Resistor Inductor
Components
Switch Connector Potentiometer LED/Nixie tube Bridge Rectifiers Connecting cables Relay Module Fuse tube PCB boards Speakers/Pickup Transmitter/receiver Component combination Other components
MORE
MORE (1) MORE (2) MORE (3) MORE (4) MORE (5)
OTHER
OTHER IC
.
XT Series
UA Series
LT Series
HM Series
PI Series
KM Series
WD Series
RP Series
FK Series
FS Series
DC Series
TD Series
FP Series
AI Series
VB Series
CH Series
TJ Series
EP Series
DD Series
KK Series
NR Series
JF Series
UN Series
TY Series
CJ Series
LN Series
BD Series
KD Series
UY Series
LK Series
ET Series
UB Series
CT Series
VT Series
TE Series
HV Series
DK Series
UP Series
FO Series
KX Series
US Series
VM Series
XS Series
GM Series
SS Series
HP Series
PR Series
DE Series
VL Series
VW Series
MT Series
AL Series
GL Series
XC Series
UL Series
EF Series
HC Series
DH Series
AO Series
TG Series
PM Series
RF Series
GN Series
LY Series
BZ Series
BT Series
IM Series
UG Series
IT Series
PW Series
SH Series
HR Series
HI Series
HZ Series
BN Series
IC Series
IS Series
AE Series
PN Series
VP Series
GD Series
AB Series
CW Series
Hot Stock
RFQ
Contact Us
Who We Are
What We Do
Industry News
Home > Industry News

Micron Launches LPCAMM2 Memory Module: 16GB to 64GB Capacities, Rates Up to 9600MT/s

Views : 24
Update time : 2024-01-20 10:12:51
        January 10, 2011 - Memory in laptops is facing a dilemma, as traditional SODIMM modules (aka scaled-down desktop memory sticks) have been in service for nearly 25 years and are about to hit a speed bottleneck. In the quest for thinner bodies, laptop makers have begun soldering LPDDR memory directly to the motherboard or integrating it into SoCs like Apple's M1 chip, making memory upgrades a luxury.
 
 
        At this year's CES in Las Vegas, Micron announced the industry's first standard Low Power Compressed Add-on Memory Module (LPCAMM2), which uses LPDDR5X memory in capacities ranging from 16GB to 64GB to provide PCs with improved performance and power efficiency, space savings, and a modular design. The LPCAMM2 memory modules are currently sampling and are scheduled to enter production in the first half of 2024, marking the first time since the introduction of the SO-DIMM specification in 1997 that a disruptive new form factor has been introduced to client PCs. 
        The new LPCAMM2 memory modules are known to support data transfer rates of 9,600 MT/s, much higher than the 6,400 MT/s of DDR5 SO-DIMMs, and while LPDDR5X is not as good as DDR5 in terms of latency, it can take advantage of the higher data transfer rates to offset it. The modular form factor does not increase the latency of LPDDR5X memory compared to soldered LPDDR5X memory subsystems. 
        Micron claims that its LPCAMM modules with LPDDR5X memory are 64 percent smaller, consume 61 percent less power, and are 71 percent faster in the PCMark 10 base performance test compared to SODIMM memory. According to JEDEC, the CAMM2 standard supports both DDR5 memory for mainstream machines, as well as LPDDR5 and LPDDR5X memory for the "broader notebook and some server markets" LPDDR memory is more common in notebook computers due to its ability to provide high-speed data transfers at low power. LPDDR memory is more common in laptops because of its ability to provide high-speed data transfers at low power consumption. 
        In addition to the speed and power advantages, the CAMM2 module gives consumers and IT staff the freedom to upgrade and repair memory again, with the minor drawback that replacing the module requires a few screws.
        Despite the slightly tongue-in-cheek name, this Micron technology and other CAMM2 products are likely to be a major breakthrough in notebook memory upgrades. Previously, JEDEC standardization organization just last December officially released the CAMM2 standard, and Samsung as early as last September claimed to be the first to develop the LPCAMM module.
        However, Micron and Samsung's LPCAMM technology is not alone. Seeing the dilemma facing traditional SODIMM memory, Dell has been developing an alternative called CAMM (Compression Attached Memory Module) for the past few years. Unlike traditional memory sticks, CAMM modules install the memory chips directly on the motherboard, taking up less space, while also offering the potential for speedups and dramatically reduced power consumption due to a shorter connection path to the CPU. Dell tested non-standard CAMM modules on its 2022 Precision 7670 notebook.
        Micron is transforming the notebook user experience with the LPCAMM2 product, which will deliver best-in-class performance per watt in a flexible, modular form factor," said Praveen Vaidyanathan, vice president and general manager of Micron's Computing Products Group. This first-of-its-kind product will enhance AI laptops with memory capacity that can be upgraded as technology and customer needs evolve."
Previous :
Next :
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i
Email