We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Home
Products
Hot Stock
TI Hot parts
CHIP/IC
CHIP / IC
Active devices
Diode / Transistor Crystal oscillator
Passive device
Capacitor Resistor Inductor
Components
Switch Connector Potentiometer LED/Nixie tube Bridge Rectifiers Connecting cables Relay Module Fuse tube PCB boards Speakers/Pickup Transmitter/receiver Component combination Other components
MORE
MORE (1) MORE (2) MORE (3) MORE (4) MORE (5)
OTHER
OTHER IC
.
XT Series
UA Series
LT Series
HM Series
PI Series
KM Series
WD Series
RP Series
FK Series
FS Series
DC Series
TD Series
FP Series
AI Series
VB Series
CH Series
TJ Series
EP Series
DD Series
KK Series
NR Series
JF Series
UN Series
TY Series
CJ Series
LN Series
BD Series
KD Series
UY Series
LK Series
ET Series
UB Series
CT Series
VT Series
TE Series
HV Series
DK Series
UP Series
FO Series
KX Series
US Series
VM Series
XS Series
GM Series
SS Series
HP Series
PR Series
DE Series
VL Series
VW Series
MT Series
AL Series
GL Series
XC Series
UL Series
EF Series
HC Series
DH Series
AO Series
TG Series
PM Series
RF Series
GN Series
LY Series
BZ Series
BT Series
IM Series
UG Series
IT Series
PW Series
SH Series
HR Series
HI Series
HZ Series
BN Series
IC Series
IS Series
AE Series
PN Series
VP Series
GD Series
AB Series
CW Series
Hot Stock
RFQ
Contact Us
Who We Are
What We Do
Industry News
Home > Industry News

Cadence and Arm Partner to Launch Automotive Die Ecosystem to Accelerate Software-Defined Vehicle Innovation

Views : 34
Update time : 2024-03-23 10:34:00
Cadence Design Systems announced a partnership with semiconductor design and software platform company Arm to provide a chip based reference design and software development platform to accelerate innovation in Software Defined Vehicles (SDVs). This car reference design was initially used for Advanced Driver Assistance Systems (ADAS) applications, specifying a scalable chip architecture and interface interoperability to promote industry wide collaboration, achieve heterogeneous integration, and expand system innovation.
 
 
The increasing popularity of ADAS and SDV has driven the demand for more complex AI and software functions, as well as higher requirements for interoperability and collaboration in the automotive electronic ecosystem. In addition, with the demand for rapid customization of 3D-IC systems for a large number of automotive applications, small chips have become increasingly attractive solutions. However, seamless collaboration between small chips from different IP suppliers is crucial. In addition, the rapid development of automotive development requires 3D-IC system developers to urgently need a software development platform, so that while IP and small chips are still being designed, they can shift left in the process to enter software development early.
Dipti Vachani, Senior Vice President and General Manager of Arm Automotive Product Line, stated that the automotive industry is rapidly developing, and the advancement of AI and software highlights the urgent need to accelerate the development cycle. Arm collaborates with key ecosystem partners such as Cadence to integrate a complete design and validation technology solution based on Arm's latest automotive enhancement technology, enabling faster software and hardware development, enabling developers to start building the next generation SDV before the chip is released, significantly reducing the development cycle.
The increasing popularity of Advanced Driver Assistance Systems (ADAS) and Software Defined Vehicles (SDVs) has driven an increasing demand for more complex artificial intelligence and software functions, and has also raised higher requirements for interoperability and collaboration within the automotive electronic ecosystem. In addition, with the need to quickly customize 3D-IC systems for a large number of automotive applications, chip technology is increasingly becoming an attractive solution. However, the key challenge for success is that chips from different IP providers can be compatible and work together. In addition, due to the rapid iteration of automotive development, 3D-IC system developers urgently need a software development platform so that they can intervene in software development in advance during the IP and chip design stages (Shift Left).
The architecture and reference design of this solution provide standards for chip interface interoperability, meeting key industry requirements. The Cadence components of this solution include the following:·
Helium for quickly creating virtual and hybrid platforms ™  Virtual and Hybrid Studio, as well as Helium Software Digital Twin that supports large-scale deployment by software developers
I/O IP solution for industry-leading interfaces and memory protocols, including Universal Chiplet Interconnect Express for high-speed chip to chip communication ™ (UCIE) ™）
Comprehensive computing IP product portfolio, including advanced artificial intelligence solutions, Neo ™ Neural Processing Unit (NPU) IP, NeuroWeave for Machine Learning (ML) Solutions ™ Software Development Kits (SDKs) and world-class DSP computing solutions
Previous :
Next :
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i
Email