We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Home
Products
Hot Stock
TI Hot parts
CHIP/IC
CHIP / IC
Active devices
Diode / Transistor Crystal oscillator
Passive device
Capacitor Resistor Inductor
Components
Switch Connector Potentiometer LED/Nixie tube Bridge Rectifiers Connecting cables Relay Module Fuse tube PCB boards Speakers/Pickup Transmitter/receiver Component combination Other components
MORE
MORE (1) MORE (2) MORE (3) MORE (4) MORE (5)
OTHER
OTHER IC
.
XT Series
UA Series
LT Series
HM Series
PI Series
KM Series
WD Series
RP Series
FK Series
FS Series
DC Series
TD Series
FP Series
AI Series
VB Series
CH Series
TJ Series
EP Series
DD Series
KK Series
NR Series
JF Series
UN Series
TY Series
CJ Series
LN Series
BD Series
KD Series
UY Series
LK Series
ET Series
UB Series
CT Series
VT Series
TE Series
HV Series
DK Series
UP Series
FO Series
KX Series
US Series
VM Series
XS Series
GM Series
SS Series
HP Series
PR Series
DE Series
VL Series
VW Series
MT Series
AL Series
GL Series
XC Series
UL Series
EF Series
HC Series
DH Series
AO Series
TG Series
PM Series
RF Series
GN Series
LY Series
BZ Series
BT Series
IM Series
UG Series
IT Series
PW Series
SH Series
HR Series
HI Series
HZ Series
BN Series
IC Series
IS Series
AE Series
PN Series
VP Series
GD Series
AB Series
CW Series
Hot Stock
RFQ
Contact Us
Who We Are
What We Do
Industry News
Home > Industry News

Dolphin Design Announces Successful Flow of First Silicon to Support 12nm FinFet Technology

Views : 36
Update time : 2024-03-04 17:51:39
        The test chip is the industry's first to offer a complete solution for audio IP using 12nm FinFet (FF) technology. The chip offers the perfect combination of high performance, low power consumption and an optimized footprint to deliver superior sound quality and functionality for battery-powered applications. This specialized test chip reaffirms Dolphin Design's industry leadership in mixed-signal IP by accelerating time-to-market, delivering best-in-class performance, and ensuring robust product design, reinforcing customer confidence in Dolphin Design products.
 
 
        Grenoble, France, February 22, 2024-Dolphin Design, an industry-leading provider of high-performance analog, mixed-signal, and processing intellectual property (IP), as well as ASIC design, has reached a major milestone with the successful silicon flow of its first 12nm FinFet test chip incorporating state-of-the-art audio IP. a major milestone. The creation of a dedicated test chip is a key step in establishing Dolphin Design as a leader in power management and audio IP, helping to continuously improve the performance and quality of its products.
        Dolphin Design continues to raise the level of expertise in the advanced processes used by its customers, which were previously done on 22nm node technology. Describing and mastering the process when designing new IP or migrating ensures optimal chip performance, and Dolphin Design's insights from test chip development play a key role in aligning with the company's aggressive performance roadmap. The insights gained from test chip development play a key role in aligning with the company's aggressive performance roadmap, which ensures that the IP will continue to evolve and meet the growing demand for performance and low power consumption.
        Features embedded in this new 12nm FinFet test chip include: four top-of-the-line low-power audio ADCs designed to dramatically reduce power consumption in line with the power levels expected from TWS and voice-controlled devices; Dolphin Design's world's best and unique headphone Class D DACs, tailored to deliver ultra-low power, low latency, and high THD+N, and developed specifically for TWS, where power efficiency is critical; and a new headphone DAC with a low-latency, high THD+N, headphone DAC with a high THD+N. efficiency-critical TWS. An ultra-compact digital PWM DAC for a wide range of devices that require an affordable audio DAC to drive speaker amplifiers, Dolphin Design's relentless pursuit of technological innovation is now at the forefront of industry-leading technology," said Hakim Jaafar, Vice President of Marketing at Dolphin Design. With this new family of IP, Dolphin Design is the first choice for low-power, high-performance audio IP. This achievement underscores our commitment to delivering breakthrough solutions to our customers and reinforces our resolve to continue innovating in the semiconductor IP space.
 
Previous :
Next :
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i
Email