We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Home
Products
Hot Stock
TI Hot parts
CHIP/IC
CHIP / IC
Active devices
Diode / Transistor Crystal oscillator
Passive device
Capacitor Resistor Inductor
Components
Switch Connector Potentiometer LED/Nixie tube Bridge Rectifiers Connecting cables Relay Module Fuse tube PCB boards Speakers/Pickup Transmitter/receiver Component combination Other components
MORE
MORE (1) MORE (2) MORE (3) MORE (4) MORE (5)
OTHER
OTHER IC
.
XT Series
UA Series
LT Series
HM Series
PI Series
KM Series
WD Series
RP Series
FK Series
FS Series
DC Series
TD Series
FP Series
AI Series
VB Series
CH Series
TJ Series
EP Series
DD Series
KK Series
NR Series
JF Series
UN Series
TY Series
CJ Series
LN Series
BD Series
KD Series
UY Series
LK Series
ET Series
UB Series
CT Series
VT Series
TE Series
HV Series
DK Series
UP Series
FO Series
KX Series
US Series
VM Series
XS Series
GM Series
SS Series
HP Series
PR Series
DE Series
VL Series
VW Series
MT Series
AL Series
GL Series
XC Series
UL Series
EF Series
HC Series
DH Series
AO Series
TG Series
PM Series
RF Series
GN Series
LY Series
BZ Series
BT Series
IM Series
UG Series
IT Series
PW Series
SH Series
HR Series
HI Series
HZ Series
BN Series
IC Series
IS Series
AE Series
PN Series
VP Series
GD Series
AB Series
CW Series
Hot Stock
RFQ
Contact Us
Who We Are
What We Do
Industry News
Home > Industry News

In 2021, the top 5 enterprises in the global total wafer production capacity contracted 57% and Samsung ranked first

Views : 581
Update time : 2022-04-21 14:42:56
        According to the "2022 Global Wafer Capacity Report" by research firm Knometa Research, 57% of the global wafer capacity in 2021 will be contracted by the top five companies (Samsung, TSMC, Micron, SK Hynix, Kioxia/Western Digital), which means The industry's "top-heavy" competitive landscape has further deepened.

        According to Semiconductor Digest, the report shows that the five companies  have a combined monthly production capacity of 12.2 million wafers in 2021, a 10% increase from the previous year and a growth rate that is one percentage point higher than the industry's total capacity.
Among them, Samsung ranks first with an average monthly output of 4.05 million wafers, accounting for 19% of the global market. TSMC ranks second with an average monthly output of 2.8 million pieces in 2021, accounting for 13% of the global market. Samsung has increased capital spending by 45% in 2020, with most of the funds going to building multiple 12-inch wafer production lines at its Pyeongtaek fab.
TSMC's relatively modest capacity growth in 2021, but strong demand for its services spurred a significant increase in capex during the year, which should lead to higher capacity growth in 2022. TSMC also plans to maintain aggressive spending in 2022 and 2023.
The third to fifth places are Micron, SK Hynix, and Kioxia/Western Digital. Among them, SK Hynix and Kioxia/Western Digital experienced a market decline.
Previous :
Next :
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i
Email