We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Industry News

Intel VP: Chip manufacturing on track, may shift to 3nm manufacturing in second half of next year

Views : 54
Update time : 2022-12-07 09:47:54
        Ann Kelleher, Intel's vice president and head of technology development, recently said that Intel is on track to achieve its goal of regaining leadership in semiconductor manufacturing.
        Kelleher said, "Intel has quarterly milestones by which we are in the lead or on track." He said Intel is currently mass-producing 7-nanometer chips, is additionally ready to begin manufacturing 4-nanometer chips and will be ready to move to 3-nanometer in the second half of next year.

        Intel CEO Kissinger has said he wants to recapture the leadership in manufacturing technology that was once one of the foundations of the company's decades-long dominance in a $580 billion industry. But as it stands, Intel's manufacturing technology is five years behind its promise, and Kelleher's team is trying to make up for it.
        If Kissinger's plan succeeds, Intel will reverse its market share loss to competitors like AMD and Nvidia. Kissinger is trying to steal business from TSMC and Samsung chip foundries, and better chip manufacturing technology will also allow Intel to attract customers.
        However, not long ago, Intel foundry services head Thakur (Randhir Thakur) has resigned. In this regard, analysts believe that Intel foundry services are afraid of facing greater challenges.


 
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i