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Home > Industry News

Intel 4nm chips are ready for production: 2nm and 1.8nm are ready ahead of schedule

Views : 96
Update time : 2022-12-07 10:25:47
        Intel is one of the few all-round companies with top chip design capabilities and manufacturing capabilities at the same time. After the new CEO Pat Kissinger took office, Intel has high hopes for the foundry business. On the one hand, it is open to accepting customers from three parties. On the other hand, it is also working on advanced processes.
        According to the latest information released by Intel, the Intel 4nm chip is ready to be put into production, and it will be used in Meteor Lake (14th Generation Core Meteor Lake) processors, ASIC network products, etc. At the same time, Intel 3nm, 20A (2nm, where A stands for Amy, 1nm = 10 Amy, the same below), 18A (1.8nm) are progressing smoothly, even slightly ahead of schedule.
On the other hand, Intel has announced that it will master the 5th generation CPU process within 4 years. CEO Kissinger previously revealed that Intel's advanced processes are beyond expectations, and the 18A process will be mass-produced half a year ahead of schedule. According to the original plan, Intel's 18A process was originally scheduled for mass production in 2025, but the exact news now is that it will be mass-produced half a year in advance, which means that Intel 20A is planned to be ready for production in the first half of 2024. The first Arrow Lake (15th generation Core) client side processor will be ready in the second half of 2024, and 18A will be used in the next generation of Core and data center products respectively. Previously, the 18A plan was in 2025. Now, the progress is very smooth, even ahead of schedule.
        Among them, Intel 3nm will be put into production in the second half of next year for Granite Rapids and S ierra Forest data center products. It is reported that starting from Intel 3nm, a new RibbonFET transistor will be used to replace the current FiFET and introduce the revolutionary PowerVias backside power supply technology. The so-called RibbonFET is actually Inetl's improvement of GAA (Surround Gate) transistors, which has been first launched by Samsung 3nm.
 
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