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Home > Industry News

Intel's chip foundry business picks up Microsoft order and Microsoft will design a chip using the Intel 18A process

Views : 42
Update time : 2024-02-28 09:45:16
        Speaking at the Intel Foundry Direct Connect conference, Microsoft Chairman and CEO Satya Nadella announced that Microsoft plans to use the Intel 18A process node to produce one of the chips it has designed. We are in the midst of a very exciting platform shift that will fundamentally change the productivity of every business and entire industries," said Satya Nadella, chairman and CEO of Microsoft. To realize this vision, we need a reliable supply of advanced, high-performance and high-quality semiconductors. That's why Microsoft is excited about working with Intel Foundry and plans to produce a chip of our design using the Intel 18A process node."
 
 
        Intel Foundry already has a large customer design portfolio across all generations of process nodes, including Intel 18A, Intel 16 and Intel 3, as well as Intel Foundry ASAT, including advanced packaging. Overall, Intel Foundry has a lifetime deal value of more than $15 billion in wafer fabrication and advanced packaging. Intel's system-level foundry model provides full-stack optimization from the fab network to software. Intel and its ecosystem provide continuously improving technologies, reference designs and new standards that enable customers to innovate at the entire system level.
        Intel provides industry-leading foundry services and accomplishes delivery through resilient, more sustainable and secure sources of supply," said Stuart Pann, senior vice president of foundry at Intel. This is complemented by the company's strong system-on-chip capabilities. Combined, these strengths enable Intel to meet the needs of our customers. Even for those most demanding applications, Intel Foundry can help customers develop and deliver solutions smoothly." In addition Intel's IP (intellectual property) and EDA (electronic design automation) partners Synopsys, Cadence, Siemens, Ansys, Lorentz and Keysight said that tools and IP are ready to help foundry customers accelerate advanced Intel 18A process node based on the industry's first backside-powered solution for Intel chip design. In addition, the partners confirmed that their EDA and IP are enabled across Intel's process nodes. At the same time, for Intel EMIB 2.5D packaging technology, several suppliers also announced plans to collaborate on the development of assembly technology and design flow. These EDA solutions will ensure that Intel can more quickly for customers to develop, deliver advanced packaging solutions.
        Intel also announced the "Emerging Business Support Program" (Emerging Business Initiative), will work with Arm, based on the Arm architecture of the system-on-chip (SoCs) to provide advanced foundry services. This program supports startups developing technologies based on the Arm architecture and provides the necessary IP, manufacturing support and financial assistance, providing Arm and Intel with significant opportunities to promote innovation and growth.
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