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LG Innotek is building an FC-BGA production line in Korea and plans to start mass production in the second half of next year, sources say

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Update time : 2022-12-25 16:50:57
        LG Innotek is preparing for the FC-BGA (Flip Chip Ball Grid Array) business, which has been seen as a new source of revenue. LG Innotek is building an FC-BGA production line at its Gumi plant in Gyeongsangbuk-do, industry sources said. Mass production is planned to start from the second half of next year.
        FC-BGA (Flip Chip Ball Grid Array) is a type of printed circuit board used for semiconductor packaging, which is also the primary packaging format for graphics accelerated chips, to transmit electrical signals and power by connecting high density semiconductor chips to the motherboard, mainly for connecting high performance and high density CPUs and GPUs, but is very expensive due to technical difficulties.
        To date, the FC-BGA market has been dominated by IBIDEN, Shinko Denki and Hana Micron, the world's largest specialist in the development and production of printed circuit boards, but companies such as Samsung Electro-Mechanics, Daedeok Electronics and Koryo Circuit are investing heavily, especially Samsung Electro-Mechanics, which began shipping FC-BGAs for servers last month, jumping to the top of the world.

        Since Jeong Cheol-dong became president, LG Innotek has been withdrawing from the high-density circuit board (HDI) and light-emitting diode (LED) fields, and has been reorganizing its business structure to choose FC-BGA as a new growth point, and in February this year decided to invest 413 billion won in this field to officially enter the market. 
        LG Innotek, which has accumulated capabilities in radio frequency (RF) packaging system (SiP) substrates and 5th generation (5G) mobile communication millimeter wave antenna package (AiP) substrates with similar manufacturing processes, is also expected to be better equipped to produce FC-BGA products.
        Since then, it has been ordering manufacturing facilities and preparing dedicated production lines. In September last year, they also presented their FC-BGA prototype to the world. LG is expected to be able to produce these products from next year onwards, although it is behind schedule due to delays in equipment delivery.


 
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