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Samsung plans to use Nvidia's "Digital Twin" technology to improve chip yields, catching up with TSMC, sources said

Views : 35
Update time : 2024-03-13 09:56:29
        March 4 news, in recent years, Samsung's foundry division has been lagging behind its rival TSMC, and the performance of the chips it produces is not comparable to TSMC's products. Samsung is reportedly planning to adopt a "Digital Twin" technology based on NVIDIA's Omniverse platform in a bid to close the gap with TSMC.
 
 
        According to an EToday report, Samsung will begin testing the NVIDIA Omniverse platform's "Digital Twin" technology to improve yields in the chip manufacturing process. The "Digital Twin" technology creates a virtual copy of the real world and then uses artificial intelligence (AI) and big data analytics to predict potential problems. If this technology is applied to chip factories, it could significantly reduce product defects and improve yields.
        The report also reveals that NVIDIA will host the GTC conference at the San Jose Convention Center in the U.S. from March 18 to 21, 2024, and a number of tech companies, including Samsung, will attend the event. It is reported that Seokjin Yoon, executive director of the Innovation Center of the DS Division of Samsung Electronics, will give a speech at the conference to introduce Samsung's "Digital Twin" chip factory based on NVIDIA's Omniverse platform, and Samsung may announce plans to launch the "Digital Twin" technology at the conference in 2025. Samsung may announce plans to launch pilot operations of the "Digital Twin" technology in 2025.
        Samsung reportedly established a Digital Twin task force in late 2022, and in April 2023 appointed Lee Young-woong, a vice president and expert in the field of Digital Twins, to head the group. Samsung's "Digital Twin" chip factory will reach Level 5, the highest level of "Digital Twin" smart factories.
        Lee Jae-yong, chairman of Samsung Electronics, has shown strong interest in NVIDIA's "Digital Twin" technology, which is seen as the future of chip manufacturing, helping to improve yields and reduce risk. According to TrendForce, Samsung's 3nm process yields 60 percent, meaning 40 out of every 100 chips are discarded due to quality issues. In comparison, TSMC's 3nm process yield is said to be around 70 percent. According to the report, TSMC has pioneered the use of "Digital Twin" technology.
 
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