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Soitec Breaks Ground on Singapore Fab Expansion Project to Further Increase Global Capacity

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Update time : 2022-12-27 09:21:57
        Soitec Semiconductor, a global leader in the design and production of innovative semiconductor materials, announced the groundbreaking of its wafer fab expansion project in Singapore's Pasir Ris Wafer Fab Park. The groundbreaking ceremony was attended by Singapore's Minister of State for Trade and Industry, Low Yen Ling, and the French Ambassador to Singapore, H.E. Minh-di Tang.
        The expansion will be dedicated to the production of 300mm SOI wafers, which will be used for smartphone chips, especially for 5G communications, as well as for automotive and smart devices. 45,000 square meters of cleanroom and office space will be added upon completion of the expansion in 2024, enabling Soitec to double its annual production capacity in Singapore to approximately 2 million 300mm SOI wafers per year.
        The expansion project is designed to meet Soitec's commitment to energy efficiency and to make the new facility a sustainable, high level office environment. Soitec is committed to doubling its workforce in Brazil to over 600 employees by 2026. At the same time, to increase its technical presence in Singapore, Soitec has launched the operation of a characterization lab at the Singapore Technology Center.
        The market for optimized substrates that Soitec can address is expected to more than triple from around 3.5 million to more than 7 million by 2026, thanks to the rapid adoption of 5G, the trend toward vehicle electrification and automation, and the booming market demand for connected smart devices. 
         The expansion of the Singapore Basili facility complements Soitec's investment plan in France and is part of Soitec's strategy to help increase its global capacity to approximately 4.5 million wafers per year by fiscal 2026 to meet growing market demand. Soitec's investments in Singapore and France are planned as part of its five-year strategy, announced in June 2021, which includes a 1.1 billion capital expenditure program. 
         Pierre Barnabé, CEO of Soitec, said: "This groundbreaking for the expansion of our Singapore plant marks another important milestone in our global development. The expansion of our production sites in France and Singapore, which are also celebrating Soitec's 30th anniversary this year, will further enhance our global presence, bring together talent, drive value and contribute more to energy efficiency by making electronics more energy efficient. The Singapore plant expansion is the perfect complement to boost capacity at our headquarters in France. The construction of the Bernin 4 plant (Benin 4) is also well underway."


 
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