We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Industry News

TSMC Announces the Highly Expected Expansion Plan of Arizona Wafer Factory

Views : 56
Update time : 2022-12-24 11:38:06
        TSMC will add a second factory to its factory in Phoenix, Arizona, and plans to produce 4nm and 3nm process chips in the next three years.
        On December 6, TSMC announced that it planned to build a second chip factory at its factory in Phoenix, Arizona, based on its initial plan to reorganize its 12 billion dollar factory. After obtaining US $40 billion in federal funds for the two fabs, the company announced that the first fab will start manufacturing 4-nanometer process chips in 2024 (improved from the original 5-nanometer process), while the second fab will start manufacturing 3-nanometer chips by 2026
.
Nanometer chips are the most advanced and latest chips in the semiconductor market today. It is reported that with the development of production, TSMC may even branch to 1-nanometer chips, but this increase in scale will be a costly effort. 
         CHIPS and the Science Act allocated $52 billion to support U.S. manufacturing, supply chain, and national security. From this fund, local and international chip manufacturers receive grants and tax incentives to consolidate the United States' position in the semiconductor industry. The fund payment scheduled to start in 2023 will be provided to foreign chip manufacturers as long as they support domestic manufacturing by building a wafer factory in the United States.
TSMC expects two plants in Arizona to produce about 600000 wafers per year. The construction of the first wafer factory has created 10000 jobs and will create another 10000 engineering jobs, of which 4500 will attract high-tech talents to directly work in the wafer factory.

 
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i