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Home > Industry News

TSMC CTO expects chip manufacturing costs to skyrocket in post-high NA lithography era

Views : 140
Update time : 2022-09-28 14:46:47
        In an interview with Bits & Chips, TSMC CTO Martin van den Brink predicted that semiconductor lithography may come to an end in the not too distant future. According to the existing roadmap, TSMC will move to high numerical aperture after extreme ultraviolet lithography (EUV). The company is now working with Imec to prepare its first research High-NA scanner in 2023.
 
 
        If all goes well, ASML is on track to deliver its first R&D machine in 2024, with the first mass production machines using the High-NA sometime in 2025. However, that eventual timing may change due to concerns about the current supply chain uncertainty.
        Because of this, current orders will be the priority. The development of Hign-NA may be put on hold if needed. Or as Martin van den Brink puts it - "today's meal takes priority over tomorrow's" (today's meal takes priority over tomorrow's). 
        In addition, as the next stage in the development of lithography, High-NA scanners are expected to be more power-hungry than EUV, about 2 megawatts at each stage, and cost prohibitive to manufacture and use.
        Martin van den Brink concludes: If the cost of "hyper-NA" skyrockets like that of "Hign-NA", it will be almost economically infeasible until this problem is overcome.

 
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