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Home > Industry News

TSMC plans to mass-produce 1nm in 2030, with 1 trillion transistors integrated in a single package

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Update time : 2024-01-09 09:17:02
        According to foreign media tomshardware reports, wafer foundry TSMC shared its latest Roadmap at the IEDM conference, plans to launch a 1nm-level A10 process in 2023, realizing the integration of 20 billion transistors on a single chip, and relying on advanced packaging technology to achieve the goal of integrating 1 trillion transistors on a single package.
 
 
        Specifically, according to TSMC's plan, it will first mass-produce 2nm-level N2 process in 2025 and N2P process around 2026, at which time it will adopt new channel materials, EUV, metal-oxide ESL, self-aligning wirew / Flexible Space, low-damage/hardened Low-K & new copper-filled technologies, which will realize the integration of more than 100 billion transistors on a single chip, while relying on advanced packaging technologies to achieve the goal of integrating 1 trillion transistors on a single package. 100 billion transistors in a single chip, and more than 5,000 transistors in a single package with advanced 3D packaging technology.
        After 2027, TSMC will also mass-produce the 1.4nm-class A14 process, and in 2030, it will mass-produce the 1nm-class A10 process, realizing the integration of more than 200 billion transistors in a single chip, and with the help of 3D packaging technology, realizing the integration of more than 1 trillion transistors in a single package.
        Although the advancement of Moore's Law has continued to slow in recent years, TSMC is confident that semiconductor chips will still be able to achieve further improvements in performance, power consumption, and transistor density over the next five or six years as 2nm, 1.4nm, and 1nm processes are introduced.
        One of the most complex monolithic processors on the market today is Nvidia's GH100, with 80 billion transistors. TSMC said that soon there will be more complex monolithic chip, the number of transistors will be more than 100 billion, but the process will become more and more complex, the cost will become higher, so many companies will choose multi-chip package design, such as AMD MI300X and Intel Ponte Vecchio is composed of dozens of chips.
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