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Home > Industry News

Qualcomm announces Snapdragon Ride Flex system-on-chip with support for both digital cockpit, ADAS and AD functionality

Views : 165
Update time : 2023-01-11 09:50:26
        Qualcomm today announced the Snapdragon Ride Flex system-on-chip (SoC), the latest addition to the Snapdragon digital chassis portfolio.
        The Snapdragon Ride Flex SoC is designed to support mixed critical-level workloads across heterogeneous computing resources, supporting digital cockpit, ADAS and AD functionality simultaneously in a single SoC, Qualcomm said.
        To achieve the highest level of automotive safety, the Snapdragon Ride Flex SoC is described as implementing isolation, interference-free and quality of service (QoS) features to specific ADAS functions at the hardware architecture level, with a dedicated safety island built in for Automotive Safety Integrity Level D (ASIL-D). At the same time, the Snapdragon Ride Flex SoC's pre-integrated software platform supports multiple operating systems running simultaneously, with isolated virtual machines and an Automotive Open Systems Architecture (AUTOSAR)-enabled real-time operating system (OS) supporting hypervisors for a mix of driver-assisted safety systems, configuration-enabled digital instrument clusters, infotainment systems, driver monitoring systems and parking assistance systems. class workloads for driver-assisted safety systems, digital instrumentation, infotainment, driver monitoring and parking assistance systems.
        Qualcomm noted that the Snapdragon Ride Flex SoC comes pre-integrated with the Snapdragon Ride vision software stack to meet regulatory requirements using front view cameras and enhanced sensing using multimodal sensors (multiple cameras, radar, LIDAR and mapping) to create models of the vehicle's surroundings for incoming vehicle control algorithms. General Safety Regulation (GSR) and can be scaled up to support higher levels of autonomous driving. 
        In addition, the Snapdragon Ride Flex Series SoCs are compatible with the broader SoC portfolio covered by Qualcomm's Snapdragon Digital Chassis platform, which is optimised for scalable performance and supports entry-level to high-end, top-of-the-range central computing systems. This enables automakers to implement complex cockpit use cases such as integrated instrument clusters for immersive high-end graphics, infotainment and gaming displays and rear entertainment screens, while creating ultra-low latency audio-based experiences and pre-integrating the Snapdragon Ride vision software stack.
 
The Snapdragon Ride Flex SoC can be developed using cloud-native automotive software development workflows, including support for virtual platform emulation, which can be integrated as part of a cloud-native DevOps and MLOps infrastructure. The first Snapdragon Ride Flex SoC is now sampling, with volume production expected to begin in 2024. Qualcomm Technologies' integrated automotive platforms, including the Snapdragon Cockpit Platform, Snapdragon CarSmart Platform and Snapdragon Ride Platform, are continuing to drive business growth, with the company's automotive business already valued at more than $30 billion in total orders, according to the data.
 
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