We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Industry News

Soitec Breaks Ground on Singapore Wafer Fab Expansion Project to Further Increase Global Capacity

Views : 107
Update time : 2022-12-28 09:29:21
        The expansion will enable Soitec to double its annual capacity at its Pasir Ris facility, bringing 300mm SOI (silicon on insulator) wafer capacity to approximately 2 million wafers per year.
 
 
        The Singapore facility is part of Soitec's strategic growth plan to meet growing global wafer demand, and is a complementary initiative to increase capacity at its headquarters in France.
        The 45,000 sqm expansion will help Soitec double its Singapore workforce to over 600 employees by 2026.
         Beijing, China, 13 December 2022 - Soitec Semiconductors, a global leader in the design and production of innovative semiconductor materials, announced the groundbreaking of its fab expansion project at the Pasir Ris Wafer Fab Park in Singapore. The groundbreaking ceremony was attended by Singapore's Minister of State for Trade and Industry, Low Yen Ling, and the French Ambassador to Singapore, H.E. Minh-di Tang.
        The expansion will be dedicated to the production of 300mm SOI wafers, which will be used for smartphone chips, especially for 5G communications, as well as for automotive and smart devices. 45,000 sqm of cleanroom and office space will be added upon completion of the expansion in 2024, enabling Soitec to double its annual production capacity in Singapore to approximately 2 million 300mm SOI wafers per year.
        The expansion project is in line with Soitec's commitment to energy efficiency and to making the new facility a sustainable, high level office environment. Soitec aims to double its workforce in Brazil to over 600 employees by 2026. At the same time, to increase its technological presence in Singapore, Soitec has launched the operation of the Singapore Technology Centre's characterisation laboratory.
        The market for optimised substrates that Soitec can cater to is expected to more than triple from around 3.5 million to over 7 million by 2026, thanks to the rapid adoption of 5G, the trend towards vehicle electrification and automation, and the booming demand for connected smart devices. 
        The expansion of the Singapore Basili facility complements Soitec's investment plan in France and is part of Soitec's strategy to help increase its global production capacity to approximately 4.5 million wafers per year by fiscal 2026 to meet growing market demand. Soitec's investments in Singapore and France are planned as part of its five-year strategy, announced in June 2021, which includes a €1.1 billion capital expenditure programme.
        Pierre Barnabé, Soitec's CEO, said: "This groundbreaking for the expansion of our Singapore plant marks another important milestone in our global development. The expansion of our production sites in France and Singapore, which are also celebrating Soitec's 30th anniversary this year, will further enhance our global presence, bring together talent, drive value and contribute more to energy efficiency by making electronics more energy efficient. The expansion of the Singapore plant is the perfect complement to the increased capacity at our headquarters in France. The construction of the Bernin 4 plant is also well underway."

 
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i