We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
Home
Products
Hot Stock
TI Hot parts
CHIP/IC
CHIP / IC
Active devices
Diode / Transistor Crystal oscillator
Passive device
Capacitor Resistor Inductor
Components
Switch Connector Potentiometer LED/Nixie tube Bridge Rectifiers Connecting cables Relay Module Fuse tube PCB boards Speakers/Pickup Transmitter/receiver Component combination Other components
MORE
MORE (1) MORE (2) MORE (3) MORE (4) MORE (5)
OTHER
OTHER IC
.
XT Series
UA Series
LT Series
HM Series
PI Series
KM Series
WD Series
RP Series
FK Series
FS Series
DC Series
TD Series
FP Series
AI Series
VB Series
CH Series
TJ Series
EP Series
DD Series
KK Series
NR Series
JF Series
UN Series
TY Series
CJ Series
LN Series
BD Series
KD Series
UY Series
LK Series
ET Series
UB Series
CT Series
VT Series
TE Series
HV Series
DK Series
UP Series
FO Series
KX Series
US Series
VM Series
XS Series
GM Series
SS Series
HP Series
PR Series
DE Series
VL Series
VW Series
MT Series
AL Series
GL Series
XC Series
UL Series
EF Series
HC Series
DH Series
AO Series
TG Series
PM Series
RF Series
GN Series
LY Series
BZ Series
BT Series
IM Series
UG Series
IT Series
PW Series
SH Series
HR Series
HI Series
HZ Series
BN Series
IC Series
IS Series
AE Series
PN Series
VP Series
GD Series
AB Series
CW Series
Hot Stock
RFQ
Contact Us
Who We Are
What We Do
Industry News
Home > Industry News

TSMC and Ge-chip to remain AMD's main foundry partners, Samsung to receive only partial 14nm orders, sources say

Views : 48
Update time : 2023-01-13 10:04:16
        At CES 2023, AMD CEO Cecilia Su explained the technology outlook for future platforms, and also brought a number of new products that continue to use TSMC's 7/6/5/4nm process. TSMC and Grosvenor are expected to remain AMD's main foundry partners through 2025, while Samsung has only received partial orders for 14nm APU and GPU products.
 
 
        TSMC has leveraged 3nm to secure major chip orders for AMD's next-generation CPUs and GPUs, and has signed a contract with AMD to build the new Radeon RX 7000 series of mobile GPUs using the 6nm process, the sources said.
        In addition, AMD will continue to build products using Gleason's 12nm and above process technology. At the end of 2021, AMD is reported to have signed a 4-year wafer supply contract with Microchip for approximately $2.1 billion in order to ensure sufficient supply in times of chip shortage. Samsung, on the other hand, appears to have only a few orders for 14nm APUs and GPUs.
        AMD is already TSMC's largest customer for its 7nm process platform consisting of N6. AMD has just launched its Ryzen 7045HX series of processors using TSMC's 5nm process, with the first products expected from Asus, Lenovo and Alienware in February. AMD has also launched the Ryzen 7040 series processors on TSMC's 4nm process, as well as the 7nm-based Raider 7035/7030 series processors.


 
Previous :
Next :
Related News
Read More >>
Qingming Festival holiday notice Qingming Festival holiday notice
Apr .02.2024
On April 4th, it is the traditional Chinese festival Qingming Festival. According to traditional customs, we will return to our hometown to worship, ancestor worship, and tomb sweeping. We will enjoy a three-day holiday and return to our hometown to worsh
Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs Microchip Technology Announces Qi® v2.0 Compliant, dsPIC33-Based Reference Designs
Mar .30.2024
Microchip has officially released the ISO 26262 functional safety package for dsPIC33C digital signal controllers (DSC), PIC18, and AVR microcontrollers (MCU), accelerating the development of safety critical designs for ASIL B and ASIL C safety levels and
Easter Notice Easter Notice
Mar .29.2024
During the Easter holiday, SIC Electronics’ companies in the United States, Hong Kong, and the United Kingdom are on holiday, but employees of the Chinese company work normally.
Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040 Infineon launches low-cost, low-power, long-distance Bluetooth module CYW20822-P4TAI040
Mar .28.2024
Infineon Technology Co., Ltd. recently announced the launch of the latest Bluetooth module CYW20822-P4TAI040, which has achieved new breakthroughs in low power consumption and coverage, promoting the further development of wireless connection technology i
Email