Functional Description
The CY62167EV30 is a high-performance CMOS static RAMorganized as 1M words by 16 bits or 2M words by 8 bits. Thisdevice features an advanced circuit design that provides an ultralow active current. Ultra low active current is ideal for providingMore Battery Life (MoBL®) in portable applications such ascellular telephones. The device also has an automatic powerdown feature that reduces power consumption by 99 percentwhen addresses are not toggling. Place the device in standbymode when deselected (CE1 HIGH or CE2 LOW or both BHE andBLE are HIGH). The input and output pins (I/O0 through I/O15)are placed in a high-impedance state when: the device isdeselected (CE1 HIGH or CE2 LOW), outputs are disabled (OEHIGH), both Byte High Enable and Byte Low Enable are disabled(BHE, BLE HIGH), or a write operation is in progress (CE1 LOW,CE2 HIGH and WE LOW).To write to the device, take Chip Enables (CE1 LOW and CE2HIGH) and Write Enable (WE) input LOW. If Byte Low Enable(BLE) is LOW, then data from I/O pins (I/O0 through I/O7) iswritten into the location specified on the address pins (A0 throughA19). If Byte High Enable (BHE) is LOW, then data from the I/Opins (I/O8 through I/O15) is written into the location specified onthe address pins (A0 through A19).To read from the device, take Chip Enables (CE1 LOW and CE2HIGH) and Output Enable (OE) LOW while forcing the WriteEnable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then datafrom the memory location specified by the address pins appearson I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data frommemory appears on I/O8 to I/O15. See Truth Table on page 12for a complete description of read and write modes
Features
■ TSOP I package configurable as 1M × 16 or 2M × 8 SRAM
■ Very high speed: 45 ns
■ Temperature ranges❐ Automotive-A: –40 °C to +85 °C
■ Wide voltage range: 2.20 V to 3.60 V
■ Ultra-low standby power❐ Typical standby current: 1.5 A❐ Maximum standby current: 12 A
■ Ultra-low active power❐ Typical active current: 2.2 mA at f = 1 MHz
■ Easy memory expansion with CE1, CE2, and OE Features
■ Automatic power-down when deselected
■ CMOS for optimum speed and power
■ Offered in Pb-free 48-ball VFBGA and 48-pin TSOP I packages
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